Semiconductor manufacturing is a professional knowledge-intensive, technology-intensive, and human capital-intensive industrial chain. It has high requirements for the office environment, manufacturing equipment, and actual operating staff. The semiconductor production process is divided into four key steps: wafer manufacturing and inspection, and integrated IC packaging and inspection. Among them, the production and inspection of wafers are generally referred to as the front-end process. The key production processes include chemical water treatment, floor plan photolithography, ion implantation, metal material accumulation/air oxidation, etc. Cationic body/organic chemical ion Injecting, etc., the inspected wafers are sent to the packaging and testing factory to carry out the production and processing of the subsequent process. The key production process includes post-spinning, epoxy curing, electrical performance testing, laser ion implantation, solder ball bonding, etc. .
How should semiconductor packaging equipment develop?
Domestic semiconductor packaging equipment does have very large deficiencies in the design scheme. These difficult problems can be quickly and obviously improved based on delicate design standards and meticulous design process management methods.
Problems such as proper function of mechanical equipment/electrical equipment, seismic resistance/scalability of mechanical system, etc. must be processed by designing a simulation tool in close connection with the data information of the actual operation of the physical line sample, and finally obtained certification on the physical line sample.
The product development of international popular manufacturers strictly follows the steps of feasibility analysis engineering project certification design plan certification trial production certification batch production certification.
In each step, a very large number of samples are constructed for sufficient testing, and the design plan is adjusted based on the test results and analysis. In addition, it is closely integrated with the customer to incorporate the equipment release qualification test into the detailed product testing steps.
The number of samples built in each link of product development reached 45 units, which is basically equivalent to the annual production volume of perfect products by Chinese equipment companies. This kind of shocking difference happens to be the direct cause of the huge difference in stability between domestic packaging equipment and major international products.
Accurate and efficient common fault capture and problem identification/analysis methods must be used to ensure that the problems that appear in the sample detection are quickly and appropriately found and the cause is found. In the end, it is necessary to create a controllable and orderly system to adjust the design plan based on the test results and analysis, and to continue to circulate the system, to ensure that the discovered problems are completely eliminated and no new problems are introduced.
How should semiconductor packaging equipment develop?
Domestic semiconductor packaging equipment does have very large deficiencies in the design scheme. These difficult problems can be quickly and obviously improved based on delicate design standards and meticulous design process management methods.
Problems such as proper function of mechanical equipment/electrical equipment, seismic resistance/scalability of mechanical system, etc. must be processed by designing a simulation tool in close connection with the data information of the actual operation of the physical line sample, and finally obtained certification on the physical line sample.
The product development of international popular manufacturers strictly follows the steps of feasibility analysis engineering project certification design plan certification trial production certification batch production certification.
In each step, a very large number of samples are constructed for sufficient testing, and the design plan is adjusted based on the test results and analysis. In addition, it is closely integrated with the customer to incorporate the equipment release qualification test into the detailed product testing steps.
The number of samples built in each link of product development reached 45 units, which is basically equivalent to the annual production volume of perfect products by Chinese equipment companies. This kind of shocking difference happens to be the direct cause of the huge difference in stability between domestic packaging equipment and major international products.
Accurate and efficient common fault capture and problem identification/analysis methods must be used to ensure that the problems that appear in the sample detection are quickly and appropriately found and the cause is found. In the end, it is necessary to create a controllable and orderly system to adjust the design plan based on the test results and analysis, and to continue to circulate the system, to ensure that the discovered problems are completely eliminated and no new problems are introduced.
